Faculty

Fei Chen

Fei Chen, assistant professor at the School of Design, Hunan University. She graduated with a Ph.D. in Mechanical Engineering from New York University in 2019. Her research interests include additive manufacturing, cyber security strategies, compressive properties of composite materials, and optimized product design for electronic devices. Her research publications include seven journal papers, one CFF-A conference paper, one book chapter (CRC Press), and one journal front cover, some of which were published on high impact journals such as Additive manufacturing and Materials&Design. She has attended top international conferences such as WiCyS, RSA conference, and ACM/CCS/CyberW workshop. She received the Best Mechanical Engineering M.S. Thesis from NYU Tandon and won the 3rd place at Falling Walls Lab NY competition. Before joining School of Design, she worked as a product design engineer at Apple R&D and new materials application engineer at OPPO R&D.

EDUCATION

New York University Tandon School of Engineering,Ph.D. in Mechanical Engineering

Beijing Jiaotong University, B.S. in Mechanical Engineering (Dual-degree program)

WORK EXPERIENCE

2021/11/1-2024/4 ,Shenzhen Yitu Trading Company (Start-up),Product Design Engineer

2020/1/6–2021/10/8 ,Apple,Product Design Engineer – iPhone

2019/8/10–2019/10/14 ,OPPO,New Material Application Engineer

PUBLICATIONS

  1. Chen, F., Mac, G., and Gupta, N., Security Features Embedded in Computer Aided Design (CAD)Solid Models for Additive Manufacturing. Materials & Design, 2017. 128: p. 182-194.https://doi.org/10.1016/j.matdes.2017.04.078 (IF:8.4)

  2. Chen, F., Luo, Y., Tsoutsos, N. G., Maniatakos, M., Shahin, K., and Gupta, N., Embedding Tracking Codes in Additive Manufactured Parts for Product Authentication. Advanced Engineering Materials,2018. 21 (4), article no. 1800495. https://doi.org/10.1002/adem.201800495 (IF: 3.6)(Altmetric Attention Score 431, rank No.1 within AEM journal)

  3. Chen, F., Gupta, N., Behera, R.K., and Rohatgi, P.K., Graphene-Reinforced Aluminum Matrix Composites: A Review of Synthesis Methods and Properties. JOM, 2018. 70 (6): p. 837-845.https://doi.org/10.1007/s11837-018-2810-7 (IF:2.6)

  4. Chen, F., Yu, J. H., and Gupta, N., Obfuscation of Embedded Codes in Additive Manufactured Components for Product Authentication. Advanced Engineering Materials, 2019. 21 (8), article no.1900146. https://doi.org/10.1002/adem.201900146 (IF:3.6)

  5. Chen, F., Zabalza, J., Murray, P., Marshall, S., Yu, J. H., Gupta, N., Embedded product authentication codes in additive manufactured parts: Imaging and image processing for improved scan ability. Additive Manufacturing, 2020. 35, article no. 101319.https://doi.org/10.1016/j.addma.2020.101319 (IF: 11.0)

  6. Chen, F., Pinisetty, D., Gupta, N., Study of the Compressive Properties of Adhesively Bonded Carbon Fiber Laminates at Different Strain Rates. Journal of Adhesion, 2021.https://doi.org/10.1080/00218464.2021.1982706 (IF:2.2)

  7. Linares, M., Aswani, N., Mac, G., Jin, C., Chen, F., Gupta, N., Karri, R., Hack3D: Crowdsourcing the Assessment of Cybersecurity in Digital Manufacturing. Computer, 2021. 54 (11): p. 58-67,https://doi.org/10.1109/MC.2021.3074192. (IF: 2.2)

  8. Gupta, N., F. Chen, N. G. Tsoutsos, M. Maniatakos, ObfusCADe: Obfuscating Additive Manufacturing CAD Models Against Counterfeiting: Invited. In Proceedings of the 54th ACM/EDAC/IEEE Annual Design Automation Conference (DAC’17). Austin, TX, USA. June 18-22, 2017. Association for Computing Machinery, New York, NY, USA, Article 82, 1–6.https://doi.org/10.1145/3061639.3079847

  9. Book Chapter:Gupta, N., Chen, F., and Shain, K., Design Features to Address Security Challenges in Additive Manufacturing, in Manufacturing Techniques for Materials: Engineering and Engineered.T.S. Srivatsan, T.S. Sudarshan, and K. Manigandan, Editors. 2018, CRC Press: Taylor & Francis Group. ISBN 9781315104133

  10. Journal Front Cover:Front Cover: Advanced Engineering Materials 4/2019. Advanced Engineering Materials, volume 21 issue 4, 21: 1970011. https://doi.org/10.1002/adem.201970011





Welcome!

close
Baidu
map